ct micro rev 3 proprietary & confidential page 1 n o v , 201 4 hir p3216q18 - c0 smd type 850nm infrared emitter package outline schematic features ? small double - end package ? viewing angle = ? 10 0 ? high radiant intensity ? high reliability ? good spectral matching to si photo detector ? rohs compliance applications ? infrared sensor description the h irp 3216 q18 - c0 is a ga al as infrared led housed in a miniature smd package. the device has a peak wavelength of 85 0nm led spectral ly matched with phototransistor or photodiode . cathode anode
ct micro rev 3 proprietary & confidential page 2 n o v , 201 4 hir p3216q18 - c0 smd type 850nm infrared emitter absolute maximum rating at 25 0 c symbol parameters ratings units notes i f continuous forward current 70 ma i fp peak forward current 0.7 a 1 v r reverse voltage 5 v t opr operating te mperature - 40 ~ +85 0 c t stg storage temperature - 40 ~ +100 0 c t sol soldering temperature 260 0 c 2 p d power dissipation at(or below) 25 free air temperature 1 40 mw r thja junction to ambient thermal resistance 540 0 c /w electro - optical characteristics ta = 25c (unless otherwise specified) optical characteristics symbol parameters test conditions min typ max units notes ie radiant i ntensity i f =20ma 12.5 2 0 - mw/sr - i f =70ma - 65 - p peak wavelength i f =20ma 830 850 870 nm ? spectral bandwidth i f =20ma - 30 - nm 1/2 angle of half intensity i f =20ma - ? 10 - deg electrical characteristics symbol parameter s test conditions min typ max units notes v f forward voltage i f =20ma 1. 30 1. 40 1. 7 v i f =70ma 1.40 1. 56 2.0 i r reverse current v r =5v - - 10 a notes: 1 : i fp conditions -- pulse width Q 100s and duty Q 1%. 2 : soldering time Q 5 seconds.
ct micro rev 3 proprietary & confidential page 3 n o v , 201 4 hir p3216q18 - c0 smd type 850nm infrared emitter typical characteristic curves
ct micro rev 3 proprietary & confidential page 4 n o v , 201 4 hir p3216q18 - c0 smd type 850nm infrared emitter typical characteristic curves
ct micro rev 3 proprietary & confidential page 5 n o v , 201 4 hir p3216q18 - c0 smd type 850nm infrared emitter package dimension all dimensions are in mm, unless otherwise stated recommended soldering mas k all dimensions are in mm, unless o therwise stated ordering information p art number description quantity h irp 3216 q1 8 - c0 ( t 1 ) tape & reel 2 000 pcs h irp 3216 q1 8 - c0 (t2) tape & reel 2 000 pcs
ct micro rev 3 proprietary & confidential page 6 n o v , 201 4 hir p3216q18 - c0 smd type 850nm infrared emitter reel dimension all dimensions are in mm, unless otherwise stated tape dimension all dimensions are in mm, unless otherwise stated part number hirp3216q18 - c0 (t1)
ct micro rev 3 proprietary & confidential page 7 n o v , 201 4 hir p3216q18 - c0 smd type 850nm infrared emitter part number hirp3216q18 - c0 (t2 )
ct micro rev 3 proprietary & confidential page 8 n o v , 201 4 hir p3216q18 - c0 smd type 850nm infrared emitter reflow profile profile feature pb - free assembly profile temperature min. (tsmin) 150c temperature max. (tsmax) 200c time (ts) from (tsmin to tsmax) 60 - 120 seconds ramp - up rate (t l to t p ) 3c/second max. liquidous temperature (t l ) 217c time (t l ) maintained above (t l ) 60 C 150 seconds peak body package temperature 260c +0c / - 5c time (t p ) within 5c of 260c 30 seconds ramp - down rate (t p to t l ) 6c/second max time 25c to peak temperature 8 minutes max.
ct micro rev 3 proprietary & confidential page 9 n o v , 201 4 hir p3216q18 - c0 smd type 850nm infrared emitter disclaimer ct mi cro reserves the right to make changes without further notice to any products herein to improve reliability, function or design. ct micro does not assume any liability arising out of the application or use of any product or circuit described herein; neithe r does it convey any license under its patent rights, nor the rights of others. ______________________________________________________________________________________ ct micro are not authorized for use as critical components in life support devices or sys tems without express written approval of ct micro international corp oration . 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perfor m when properly used in accordance with instruction for use provided in the label l ing, can be reasonably expected to result in significant injury to the user. 2. a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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